XCENA 和 Samsung 在一张 CXL 内存卡上搭载了 3,072 个 RISC-V 核心
Jin Kim 的原型将 2TB DDR5、基于 SSD 的内存和近数据处理结合在一起，XCENA 目标是在 2026 年末投产。
By RuntimeWire Staff · Published
Primary source: Chips and Cheese
为何重要
XCENA 正在将内存转变为可编程计算层，这一押注如果 MX1 能通过生产和软件集成测试，可能会降低 AI 推理成本。
Jin Kim and XCENA, the South Korean computational-memory developer he co-founded, used Hot Chips 2026 on August 25th to demonstrate a memory expansion card that can execute selected jobs itself. MX1 combines up to 2TB of DDR5, SSD-backed memory and 3,072 small RISC-V cores on silicon manufactured with Samsung Electronics' 4nm process.…
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